X-ray diffraction | Shenzhen Railay Technology | Wuxi X-ray diffractometer provided by Railay technology. X-ray diffraction, Shenzhen Railay Technology, Xuzhou, X-ray diffraction is Railay Technology Development Co., Ltd. of Shenzhen City (www.inov-x.com) 2014 upgrade been newly launched X-ray diffractometer using diffraction theory, accurate determination Crystal structure of matter, texture and stress, accurate phase analysis, qualitative analysis, quantitative analysis. Widely used in metallurgy, petroleum, chemical, scientific research, aerospace, education, material production, etc. affect the particle size of the sample results in order to more fully illustrate the extent of the particle size effect on the test results, we selected from 内蒙古巴丹Jaran desert surface mineral samples to be analyzed. using Rigaku (Rigaku) ??produced D/Max2400 multi-crystal X-ray diffraction test. Cu target (λ = 0. 154056 nm), tube voltage 40 kV, tube current 60 mA X-ray diffraction, scanning speed of 10 deg. / min, in steps of 0. 02 °, DS (divergence slit) = SS (anti-scatter slit) = 1 °, RS (receiving slit) = 0. 3 mm. thoroughly grinding the samples were sieved samples were small to large fineness of 45,48,58,75,150 μm 5 grades, and the resulting X-ray diffraction analysis shown in Figure 1 can be seen from FIG. Nanjing, X-ray diffraction, particle size of 150μm sample diffraction peaks of the weakest, the back end of the strongest Changzhou diffraction X-ray diffraction, the weak part of the content of the sample material which has not been swept out of the diffraction peaks For particle size 75,58, Samples 48 and 45μm, with decreases in Wuxi X-ray diffraction, the diffraction peak intensity becomes larger and larger, the diffraction peaks of trace constituents of matter gradually become strong determination of the X-ray stress measurement of stress changes in the diffraction pattern characteristic particle size As a measure of strain. Macroscopic stress evenly distributed within the range of the larger objects, that uniform strain performance within the same range produced by the crystal orientation plane of the same name in the same pitch changes, resulting in a direction of displacement of the diffraction line, which is the X-ray stress measuring macro basis; microscopic stress among the crystal grains of a grain or different from each other between the parts, to produce uniform strain showed some areas of the interplanar spacing increases, reducing the distance between certain regions of the crystal surface, resulting in different diffraction line the direction of displacement, so diffuse diffraction line broadening, which is the basis of X-ray measurement of microscopic stress. Ultra-microscopic stress strain to make atomic deviation from the equilibrium position of the region, leading to weakening of the diffraction lines, the ultra-microscopic stress can be measured by changes in X-ray intensity. Stress is generally measured by diffractometer.